Pcb assembly service manufacturer from China? Since beginning, as a printed circuit board (PCB) vendor in Asia, Best Technology is dedicating to be your best partner of advance, high-precision printed circuit boards, such as heavy copper boards, ultra thin PCB, mixed layers, high TG, HDI, high frequency (Rogers, Taconic), impedance controlled board, Metal Core PCB (MCPCB) such as Aluminum PCB, Copper PCB, and Ceramic PCB (conductor Copper, AgPd, Au, etc) and so on. Discover additional information at ultra thin core pcb. The layer on top of the copper foil is called the soldermask layer. This layer gives the PCB its green (or, at PCB & MCPCB, red) color. It is overlaid onto the copper layer to insulate the copper traces from accidental contact with other metal, solder, or conductive bits. This layer helps the user to solder to the correct places and prevent solder jumpers. In the example below, the green solder mask is applied to the majority of the PCB, covering up the small traces but leaving the silver rings and SMD pads exposed so they can be soldered to. Soldermask is most commonly green in color but nearly any color is possible. We use red for almost all the PCB & MCPCB boards, white for the IOIO board, and purple for the Best Technology boards.
A single sided flexible printed circuit (1 layer flex circuit) is a flex circuit with one layer of copper trace on one substrate, and with one layer Polyimide coverlay laminated to copper trace so that only one side copper will be exposed, so that it only allowing access to copper trace from one side, comparing to dual access flex circuit which allows access from both top and bottom side of flex circuit. As there’s only one layer of copper trace, so it also named as 1 layer flexible printed circuit, or 1 layer flexible circuit, or even 1 layer FPC, or 1L FPC. The multi layer flex circuit refer to a flex circuit with more than 2 layer circuit layers. Three or more flexible conductive layers with flexible insulating layers between each one, which are interconnected by way of metallized hole through the vias/holes and plating to form a conductive path between the different layers, and external are polyimide insulating layers. Art-of-state Technology: Most of our engineer and operators has more than ten years of experience in PCB industry, so we can produce special such as 20 OZ heavy copper board, 4 layer MCPCB, etc.
Tg means Glass Transition Temperature. As flammability of printed circuit board (PCB) is V-0 (UL 94-V0), so if the temperature exceeds designated Tg value, the board will changed from glassy state to rubbery state and then the function of PCB will be affected. If working temperature of your product is higher than normal (130-140C), then have to use High Tg PCB material which is > 170C. and popular PCB high value are 170C, 175C, and 180C. Normally the FR4 circuit board Tg value should be at least 10-20C higher than working temperature of product. If you 130TG board, working temperature will be lower than 110C; if use 170 high TG board, then maximum working temperature should be lower than 150C.
Dust can cause damage in multiple ways. Firstly, it can reduce the heat dissipation of a device. It also contributes to damage by way of static electricity. Storing a PCB in temperatures that are not optimal can certainly lead to damage! Temperatures that are too low lead to condensation that adversely affects the PCB. Similarly, temperatures that are too high lead to warpage. If PCBs are stored in the proximity of chemical reagents, the fumes from the reagents tend to corrode the PCB. Finally, storing PCBs in a place that is infested with pests can lead to biting the PCBs and rendering them unusable.
According to different manufacturing method, current there’re three basic types for ceramic board: A) Thick Film Ceramic Board Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB. B) DCB Ceramic Board DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure. Discover more information at https://www.bstpcb.com/.
Advantage of MCPCB: Some LEDs dissipate between 2-5W of heat and failures occur when the heat from a LED is not properly removed; a LED’s light output is reduced as well as degradation when the heat remains stagnant in the LED package. The purpose of a MCPCB is to efficiently remove the heat from all topical IC’s (not just LEDs). The aluminum base and thermally conductive dielectric layer act as bridges between the IC’s and heat sink. One single heat sink is mounted directly to the aluminum base eliminating the need for multiple heat sinks on top of the surface mounted components.